MTSKOREA (Since2010)
031 499 9790
lih7701@naver.com
1.반도체 후공정 장비 ( semiconductor backend equipment )_ Equipment Technology Alliance
-Ball Mounter System, Laser Marking System,INK Marking System, Wafer Tape Bonding System, Strip Tape Bonding System, Wafer Dicing Saw System(Single Head &Dual Head), Strip Dicing Saw System (Single Head &Dual Head) ,Wafer Sort system, Strip Sort system, Pick&Place System,Test Handler System, On Loader System, Off Loader System,Tape&Reel System, Semiconductor In-line System,FPCB Auto Press,Package Solder system,Trim & Form System,Laser PKG Deflash System,Solder Ball Bonding System
2.Dicing Saw Chiller system