Die Bonder Systems

엠티에스코리아james9790@daum.net031 499 9790<hr data-ke-style="style5">"Gang Die 2차 Bonder System" “원천 핵심 기술과 풍부한 경험의 시너지” 1. 장비 개요<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignCenter" style="width: 97.7358%; height: 150px;" border="1"><tbody><tr style="height: 10px;"><td style="width: 23.8095%; height: 10px; text-align: center;">항목</td><td style="width: 76.0618%; height: 10px; text-align: center;">내용</td></tr><tr style="height: 20px;"><td style="width: 23.8095%; height: 20px; text-align: center;">장비명</td><td style="width: 76.0618%; height: 20px; text-align: center;">Panel-Level Multi-Die Gang Bonder</td></tr><tr style="height: 20px;"><td style="width: 23.8095%; height: 20px; text-align: center;">적용공정</td><td style="width: 76.0618%; height: 20px; text-align: center;"> CSP, Fan-Out WLP, Panel-Level Packaging, SiP </td></tr><tr style="height: 20px;"><td style="width: 23.8095%; height: 20px; text-align: center;">본딩방식</td><td style="width: 76.0618%; height: 20px; text-align: center;"> Thermo-Compression Bonding (Gang Press) </td></tr><tr style="height: 20px;"><td style="width: 23.8095%; height: 20px; text-align: center;">최대 칩 수</td><td style="width: 76.0618%; height: 20px; text-align: center;"> 100개 / Panel </td></tr><tr style="height: 20px;"><td style="width: 23.8095%; height: 20px; text-align: center;">접합재</td><td style="width: 76.0618%; height: 20px; text-align: center;"> Hybrid Conductive Film (HCF) </td></tr><tr style="height: 20px;"><td style="width: 23.8095%; height: 20px; text-align: center;">자동화</td><td style="width: 76.0618%; height: 20px; text-align: center;"> Loader/Unloader, Vision Alignment, Robot Interface </td></tr><tr style="height: 20px;"><td style="width: 23.8095%; height: 20px; text-align: center;">제어</td><td style="width: 76.0618%; height: 20px; text-align: center;"> Multi-Zone Temperature + Multi-Point Pressure Feedback, Closed-loop PID </td></tr></tbody></table></div>2. 기구 사양   - Bonding Head: <ul style="list-style-type: circle;" data-ke-list-type="circle"><li>Multi-Zone Heating Plate (3~5 Zones) </li><li>Head Height Adaptive, Coplanarity Compensation ±10 µm</li><li>헤드 재질: 고열전도 합금강</li></ul>    -Press Mechanism <ul style="list-style-type: circle;" data-ke-list-type="circle"><li>Servo Motor + High-Precision Ball Screw    </li><li>Multi-Die Gang Press    </li><li>최대 가압력: 5 ton / Panel </li></ul>     -워크테이블 <ul style="list-style-type: circle;" data-ke-list-type="circle"><li>Vacuum Chuck + Coplanarity / Warpage Compensation</li><li>Table Load Cell: Multi-Point Global Force Feedback</li></ul>3. 전기/제어 사양<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>PLC 기반 제어 (Siemens / Allen-Bradley 선택 가능)</li><li>Multi-Zone PID Temperature Control (±2℃)</li><li>Load Cell Closed-loop Pressure Control (±1% F.S)</li><li>Servo + EtherCAT Motion Control (압력 및 위치 제어)</li><li>HMI: 15″ Touch Panel, Recipe Management, Process Monitoring</li><li>MES Integration: OPC UA / SECS-GEM</li></ul>4. 공정 조건<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 98.3127%; height: 116px;" border="1"><tbody><tr style="height: 18px;"><td style="width: 22.9193%; height: 18px; text-align: center;">항목</td><td style="width: 77.0807%; height: 18px; text-align: center;">범위</td></tr><tr style="height: 20px;"><td style="width: 22.9193%; height: 20px; text-align: center;">온도</td><td style="width: 77.0807%; height: 20px; text-align: center;">80~350℃, Multi-Zone ±2℃</td></tr><tr style="height: 20px;"><td style="width: 22.9193%; height: 20px; text-align: center;">압력</td><td style="width: 77.0807%; height: 20px; text-align: center;">100~5000 kgf, 칩별 조정 가능</td></tr><tr style="height: 20px;"><td style="width: 22.9193%; height: 20px; text-align: center;">가압 유지시간</td><td style="width: 77.0807%; height: 20px; text-align: center;">1~30 sec, Ramp/Soak 프로그램 가능</td></tr><tr style="height: 20px;"><td style="width: 22.9193%; height: 20px; text-align: center;">Cycle Time</td><td style="width: 77.0807%; height: 20px; text-align: center;">패널/칩 수량 및 재료에 따라 최적화 가능</td></tr><tr style="height: 18px;"><td style="width: 22.9193%; height: 18px; text-align: center;">Cooling</td><td style="width: 77.0807%; height: 18px; text-align: center;">자연냉각 또는 Forced Air / Liquid Cooling 가능</td></tr></tbody></table></div> 5. 자동화 시스템<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>Loader / Unloader : Magazine Type, Servo X-Y-Z,Pusher Unit</li><li>Strip Feeding: Rail Auto Conversion, Stage Up/Down</li><li>Panel Feeding: Reel-to-Reel HCF 공급 대응(Type)</li><li>Inspection Integration: Post-Bond X-Ray / Vision Optional</li></ul> 6. 안전 및 환경<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>Safety Interlock / Light Curtain / Emergency Stop</li><li>Thermal Shielding 및 ESD 보호</li><li>Cleanroom Class 100~1000 </li></ul><hr data-ke-style="style5">"Hybrid Die Bonder System "  <hr data-ke-style="style5">"Flip Chip Bonder System(COF)"<div class="imagegridblock" data-ke-type="imageGrid"><div class="image-container"><img src="https://t1.daumcdn.net/cafeattach/1Z2QS/c164b18162a9f1f727549ffed01fc67f6634f9f8" class="txc-image-grid"><img src="https://t1.daumcdn.net/cafeattach/1Z2QS/4c8f62c3cc86cac1ef98aaa9e12afa88691e82ee" class="txc-image-grid"><img src="https://t1.daumcdn.net/cafeattach/1Z2QS/27cf401a9dfcdc4d3896f96daed24125781a67ae" class="txc-image-grid"></div></div><hr data-ke-style="style5">Equipment OverviewFlip Chip Bonder는 반도체 패키징 공정에서 COF(Chip on Film) 및 Micro Chip을 고정밀로 정렬하고 열압착 본딩을 수행하는 자동화 장비입니다.본 장비는 Tape Feeding System과 Multi Heating Stage, Vision Alignment 기술을 기반으로 안정적인 Flip Chip Bonding 공정을 제공합니다.고속 생산성과 정밀도를 동시에 확보하여 반도체, 디스플레이 드라이버 IC, FPCB 패키징 공정에 최적화된 장비입니다.<hr data-ke-style="style5">Key Features High Precision Alignment <ul style="list-style-type: disc;" data-ke-list-type="disc"><li>Dual CCD Vision System </li><li> ±5㎛ 이하 정렬 정밀도 </li><li> 고해상도 이미지 프로세싱 </li></ul> Multi Heating Stage Technology<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>4 Stage Pre-Heater 구조 </li><li> 균일한 열 분포 </li><li> 안정적인 Thermo Compression Bonding </li></ul> High Speed Production<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>고속 Tape Index 구조</li><li>자동 Pick & Place 시스템</li><li>최대 3000 UPH 생산성</li></ul> Stable COF Tape Transport<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>Servo Motor Feeding System</li><li>Tension Control Roller</li><li>Tape Splicer 적용</li></ul><hr data-ke-style="style5">Process Flow COF Tape 공정 흐름 Loader → Tape Feeding → Flux Dispense → Vision Inspection → Heater Stage → Flip Chip Bonding → Unloader Die 공정 흐름 Wafer Frame → Die Pick → Needle Separation → Vacuum Pick Head → Vision Alignment → Bonding<hr data-ke-style="style5">System Configuration   -COF Loader & Unloader<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>Reel Type Tape Handling System</li><li>Automatic Tension Control</li><li>Tape Splicing System</li></ul>  -Tape Feeding Module<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>Servo Driven Feeding System</li><li>High Precision Position Control</li></ul>  -Dispenser & Vision Unit<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>Flux Dispense System</li><li>Dual CCD Camera Alignment</li></ul>  -Multi Heater Stage<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>4 Stage Pre-heating System</li><li>High Stability Temperature Control</li></ul>  -Flip Chip Bonding Head<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>Z Axis Servo Press</li><li>High Precision Force Control</li><li>Thermo Compression Bonding</li></ul>  -Die Pick & Place System<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>XY Precision Stage</li><li>Needle Pin Die Separation</li><li>Vacuum Pick Head</li></ul><hr data-ke-style="style5">Technical Specifications<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 100%; height: 70px;" border="1"><tbody><tr style="height: 10px;"><td style="width: 32.913%; height: 10px; text-align: center;">Item</td><td style="width: 66.9609%; height: 10px; text-align: center;">Specification</td></tr><tr style="height: 10px;"><td style="width: 32.913%; height: 10px; text-align: center;">Bonding Accuracy</td><td style="width: 66.9609%; height: 10px; text-align: center;">±5 µm</td></tr><tr style="height: 10px;"><td style="width: 32.913%; height: 10px; text-align: center;">Production Capacity</td><td style="width: 66.9609%; height: 10px; text-align: center;">Up to 3000 UPH</td></tr><tr style="height: 10px;"><td style="width: 32.913%; height: 10px; text-align: center;">Heater Temperature</td><td style="width: 66.9609%; height: 10px; text-align: center;">Max 350°C</td></tr><tr style="height: 10px;"><td style="width: 32.913%; height: 10px; text-align: center;">Vision Resolution</td><td style="width: 66.9609%; height: 10px; text-align: center;">5 µm</td></tr><tr style="height: 10px;"><td style="width: 32.913%; height: 10px; text-align: center;">Wafer Size</td><td style="width: 66.9609%; height: 10px; text-align: center;">6 ~ 12 inch</td></tr><tr style="height: 10px;"><td style="width: 32.913%; height: 10px; text-align: center;">Tape Width</td><td style="width: 66.9609%; height: 10px; text-align: center;">35 ~ 70 mm</td></tr></tbody></table></div><hr data-ke-style="style5">Application본 장비는 다음 산업 분야에서 사용됩니다.<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>Semiconductor Packaging</li><li>Display Driver IC</li><li>COF Packaging</li><li>FPCB Assembly</li><li>Advanced Flip Chip Packaging</li></ul>Advantages✔ 고정밀 Flip Chip Bonding 기술 ✔ 안정적인 Tape Index 시스템 ✔ Multi Heater Thermal Control ✔ 고속 자동화 생산라인 대응