3S, FOPLP (Fan-Out Panel Level Package)용 FOUP을 개발성공 양산중

[상 한 가s]

3S,  FOPLP 초대형 호재
엔비디아 TSMC 패키징 부족에 FOPLP 대안 급부상, 삼성전자에 기회 - 1보
3S,  FOPLP (Fan-Out Panel Level Package)용 FOUP을 개발성공 양산중 (종합)
***** 3S (060310)

https://www.businesspost.co.kr/BP?command=article_view&num=353907

https://www.businesspost.co.kr/BP?command=article_view&num=353907


엔비디아 TSMC 패키징 부족에 FOPLP로 대안 찾아, 삼성전자에 기회 주목

https://n.news.naver.com/mnews/article/277/0005113175?sid=101
3S는 지난 6년간 반도체 후공정 패키지용 FOPLP (Fan-Out Panel Level Package)용 FOUP을 개발해 양산라인에 공급한 실적을 인정받았다