Wafer Mounter&OCR System

엠티에스코리아james9790@daum.net031 499 9790<hr data-ke-style="style5"><div class="imagegridblock" data-ke-type="imageGrid"><div class="image-container"><img src="https://t1.daumcdn.net/cafeattach/1Z2QS/6196b81a0fa9b7cd229a78ec5714369efb2c38c2" class="txc-image-grid"><img src="https://t1.daumcdn.net/cafeattach/1Z2QS/c3a5cfc9fee3674fce4091ca8938e264a27b2dc7" class="txc-image-grid"></div></div><div class="imagegridblock" data-ke-type="imageGrid"><div class="image-container"><img src="https://t1.daumcdn.net/cafeattach/1Z2QS/8e19a843195a6a8d9819a80a7789bf8e772c0c99" class="txc-image-grid"><img src="https://t1.daumcdn.net/cafeattach/1Z2QS/3ac5f28fb1d58972649e5ebaf7ef65cd62a9ebb8" class="txc-image-grid"><img src="https://t1.daumcdn.net/cafeattach/1Z2QS/3bebe9b0cc5eca7db4d4628562e70ea14ef94b18" class="txc-image-grid"></div></div><hr data-ke-style="style5">📄 Wafer Mounter System1. 장비 개요 Saw 공정이 완료된 Wafer를 Ring Frame에 정밀 정렬하여 Mounting(Bonding)하고, Frame ID 각인 및 Bar-Code 인쇄, OCR/Barcode 검사까지 자동으로 수행하는 통합 자동화 설비입니다. Frame Magazine의 자동 적재 및 배출 기능을 포함하여 생산 효율성과 품질 신뢰성을 동시에 확보합니다.<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 100%; height: 151px;" border="1"><tbody><tr style="height: 10px;"><td style="width: 26.1034%; height: 10px; text-align: center;">항목</td><td style="width: 73.7705%; height: 10px; text-align: center;">내용</td></tr><tr style="height: 20px;"><td style="width: 26.1034%; height: 20px; text-align: center;">장비명</td><td style="width: 73.7705%; height: 20px; text-align: center;">Wafer Mounter & OCR Integrated System</td></tr><tr style="height: 20px;"><td style="width: 26.1034%; height: 20px; text-align: center;">적용공정</td><td style="width: 73.7705%; height: 20px; text-align: center;">Back-End (Saw / Dicing 전 공정)</td></tr><tr style="height: 41px;"><td style="width: 26.1034%; height: 41px; text-align: center;">기능</td><td style="width: 73.7705%; height: 41px; text-align: center;">Wafer UV Tape Mounting + Wafer ID OCR + Barcode Verification + Ring Frame Assembly</td></tr><tr style="height: 20px;"><td style="width: 26.1034%; height: 20px; text-align: center;">적용웨이퍼</td><td style="width: 73.7705%; height: 20px; text-align: center;">8", 12" (Option: 6")</td></tr><tr style="height: 20px;"><td style="width: 26.1034%; height: 20px; text-align: center;">적용 Tape</td><td style="width: 73.7705%; height: 20px; text-align: center;">UV Dicing Tape (8/12 inch reel type)</td></tr><tr style="height: 20px;"><td style="width: 26.1034%; height: 20px; text-align: center;">생산성</td><td style="width: 73.7705%; height: 20px; text-align: center;">≥ 120 WPH (12인치 기준)</td></tr></tbody></table></div><hr data-ke-style="style5">2. 공정 Flow<ol style="list-style-type: decimal;" data-ke-list-type="decimal"><li>FOUP Load</li><li>Dual Arm Wafer Handling Robot</li><li>Wafer Aligner (Pre-Align & Notch/Flat Detect)</li><li>Wafer Flipper</li><li>Wafer Mount Table (Vacuum Chuck)</li><li>UV Tape Reel Module (Auto Tension Control)</li><li>Ring Frame Auto Loader</li><li>Pick & Place Module</li><li>Secondary Flipper (Front/Back OCR 대응)</li><li>C/V Conveyor (Vision Inspection Path)</li><li>OCR Vision Module</li><li>Barcode Printer</li><li>Rotation Unit (0~360°)</li><li>Barcode Reader (2D/1D)</li><li>Wafer Ring Pusher</li><li>Bin Cassette Buffer (3 Port)</li><li>Elevator Transfer System</li><li>Ring Frame Receiving Position</li><li>Auto Unload to Cassette</li></ol>3. 주요 모듈 사양3.1 FOUP & 로딩 시스템<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 100%; height: 100px;" border="1"><tbody><tr style="height: 20px;"><td style="height: 20px; text-align: center;">항목</td><td style="height: 20px; text-align: center;">사양</td></tr><tr style="height: 20px;"><td style="height: 20px; text-align: center;">FOUP Type</td><td style="height: 20px; text-align: center;">SEMI E47 / E62 compliant</td></tr><tr style="height: 20px;"><td style="height: 20px; text-align: center;">Load Port</td><td style="height: 20px; text-align: center;">2~4 Port (Option)</td></tr><tr style="height: 20px;"><td style="height: 20px; text-align: center;">Mapping</td><td style="height: 20px; text-align: center;">Slot Mapping Sensor</td></tr><tr style="height: 20px;"><td style="height: 20px; text-align: center;">OHT Interface</td><td style="height: 20px; text-align: center;">SEMI E84 Support</td></tr></tbody></table></div>3.2 Wafer Handling Robot<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 100%;" border="1"><tbody><tr><td style="text-align: center;">항목</td><td style="text-align: center;">사양</td></tr><tr><td style="text-align: center;">Type</td><td style="text-align: center;">Dual Arm SCARA or Vacuum Robot</td></tr><tr><td style="text-align: center;">Repeatability</td><td style="text-align: center;">±0.02 mm</td></tr><tr><td style="text-align: center;">Particle Spec</td><td style="text-align: center;">Class 1 Compatible</td></tr><tr><td style="text-align: center;">Wafer Size</td><td style="text-align: center;">8" / 12"</td></tr></tbody></table></div>3.3 Wafer Aligner<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 100%;" border="1"><tbody><tr><td style="width: 28.8777%; text-align: center;">항목</td><td style="width: 70.9962%; text-align: center;">사양</td></tr><tr><td style="width: 28.8777%; text-align: center;">Alignment Accuracy</td><td style="width: 70.9962%; text-align: center;">±0.05°</td></tr><tr><td style="width: 28.8777%; text-align: center;">Notch Detection</td><td style="width: 70.9962%; text-align: center;">IR + Vision Hybrid</td></tr><tr><td style="width: 28.8777%; text-align: center;">Run-out Accuracy</td><td style="width: 70.9962%; text-align: center;">≤ 0.1 mm</td></tr></tbody></table></div>3.4 Flipper Unit<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 100%;" border="1"><tbody><tr><td style="width: 29.0038%; text-align: center;">항목</td><td style="width: 70.8701%; text-align: center;">사양</td></tr><tr><td style="width: 29.0038%; text-align: center;">Rotation</td><td style="width: 70.8701%; text-align: center;">180° Flip</td></tr><tr><td style="width: 29.0038%; text-align: center;">Handling Type</td><td style="width: 70.8701%; text-align: center;">Vacuum Edge Grip</td></tr><tr><td style="width: 29.0038%; text-align: center;">Breakage Rate</td><td style="width: 70.8701%; text-align: center;">≤ 0.01%</td></tr></tbody></table></div>3.5 UV Tape Reel Module (최신형)<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 100%;" border="1"><tbody><tr><td style="width: 28.8777%; text-align: center;">항목</td><td style="width: 70.9962%; text-align: center;">사양</td></tr><tr><td style="width: 28.8777%; text-align: center;">Tape Type</td><td style="width: 70.9962%; text-align: center;">UV Curable Dicing Tape</td></tr><tr><td style="width: 28.8777%; text-align: center;">Reel Auto Change</td><td style="width: 70.9962%; text-align: center;">Optional Auto Splice</td></tr><tr><td style="width: 28.8777%; text-align: center;">Tension Control</td><td style="width: 70.9962%; text-align: center;">Closed-loop Servo Control</td></tr><tr><td style="width: 28.8777%; text-align: center;">Tension Accuracy</td><td style="width: 70.9962%; text-align: center;">±2%</td></tr><tr><td style="width: 28.8777%; text-align: center;">Bubble Detection</td><td style="width: 70.9962%; text-align: center;">Inline Vision Detection</td></tr></tbody></table></div>3.6 Wafer Mount Table<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 100%;" border="1"><tbody><tr><td style="width: 29.256%; text-align: center;">항목</td><td style="width: 70.6179%; text-align: center;">사양</td></tr><tr><td style="width: 29.256%; text-align: center;">Chuck Type</td><td style="width: 70.6179%; text-align: center;">Vacuum Porous Chuck</td></tr><tr><td style="width: 29.256%; text-align: center;">Flatness</td><td style="width: 70.6179%; text-align: center;">≤ 5 μm</td></tr><tr><td style="width: 29.256%; text-align: center;">Lamination Pressure</td><td style="width: 70.6179%; text-align: center;">Programmable</td></tr><tr><td style="width: 29.256%; text-align: center;">Lamination Speed</td><td style="width: 70.6179%; text-align: center;">50~300 mm/sec</td></tr><tr><td style="width: 29.256%; text-align: center;">Air Bubble Reject</td><td style="width: 70.6179%; text-align: center;">Auto Detect & Retry</td></tr></tbody></table></div>3.7 OCR Vision Module (최신 AI Vision 적용)<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 100%;" border="1"><tbody><tr><td style="width: 29.5082%; text-align: center;">항목</td><td style="width: 70.3657%; text-align: center;">사양</td></tr><tr><td style="width: 29.5082%; text-align: center;">Camera</td><td style="width: 70.3657%; text-align: center;">12~25MP Industrial Camera</td></tr><tr><td style="width: 29.5082%; text-align: center;">Lighting</td><td style="width: 70.3657%; text-align: center;">Coaxial + Side IR</td></tr><tr><td style="width: 29.5082%; text-align: center;">OCR Type</td><td style="width: 70.3657%; text-align: center;">Laser Mark / Ink Mark</td></tr><tr><td style="width: 29.5082%; text-align: center;">Recognition Rate</td><td style="width: 70.3657%; text-align: center;">≥ 99.98%</td></tr><tr><td style="width: 29.5082%; text-align: center;">AI Deep Learning</td><td style="width: 70.3657%; text-align: center;">Character Self-Learning</td></tr><tr><td style="width: 29.5082%; text-align: center;">Data Interface</td><td style="width: 70.3657%; text-align: center;">SECS/GEM, OPC-UA</td></tr></tbody></table></div>3.8 Barcode System<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 100%;" border="1"><tbody><tr><td style="width: 29.8865%; text-align: center;">항목</td><td style="width: 69.9874%; text-align: center;">사양</td></tr><tr><td style="width: 29.8865%; text-align: center;">Printer</td><td style="width: 69.9874%; text-align: center;">300~600 dpi Thermal Transfer</td></tr><tr><td style="width: 29.8865%; text-align: center;">Reader</td><td style="width: 69.9874%; text-align: center;">1D/2D (Data Matrix)</td></tr><tr><td style="width: 29.8865%; text-align: center;">Verification</td><td style="width: 69.9874%; text-align: center;">ISO/IEC 15415 Grade A/B</td></tr><tr><td style="width: 29.8865%; text-align: center;">Inline Reject</td><td style="width: 69.9874%; text-align: center;">Auto Diverter</td></tr></tbody></table></div>3.9 Rotation Unit<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 99.3694%; height: 10px;" border="1"><tbody><tr style="height: 10px;"><td style="width: 30.7107%; height: 10px; text-align: center;">항목</td><td style="width: 69.1624%; height: 10px; text-align: center;">사양</td></tr><tr><td style="width: 30.7107%; text-align: center;">Range</td><td style="width: 69.1624%; text-align: center;">0~360°</td></tr><tr><td style="width: 30.7107%; text-align: center;">Resolution</td><td style="width: 69.1624%; text-align: center;">0.01°</td></tr><tr><td style="width: 30.7107%; text-align: center;">Control</td><td style="width: 69.1624%; text-align: center;">Servo Motor</td></tr></tbody></table></div>3.10 Bin Cassette Buffer<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 100%;" border="1"><tbody><tr><td style="width: 31.3997%; text-align: center;">항목</td><td style="width: 68.4741%; text-align: center;">사양</td></tr><tr><td style="width: 31.3997%; text-align: center;">Capacity</td><td style="width: 68.4741%; text-align: center;">3 Cassette</td></tr><tr><td style="width: 31.3997%; text-align: center;">Elevator Stroke</td><td style="width: 68.4741%; text-align: center;">300~500 mm</td></tr><tr><td style="width: 31.3997%; text-align: center;">Auto Positioning</td><td style="width: 68.4741%; text-align: center;">±0.05 mm</td></tr></tbody></table></div>4. 시스템 제어 사양<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 100%; height: 120px;" border="1"><tbody><tr style="height: 20px;"><td style="width: 31.7781%; height: 20px; text-align: center;">항목</td><td style="width: 68.0958%; height: 20px; text-align: center;">사양</td></tr><tr style="height: 20px;"><td style="width: 31.7781%; height: 20px; text-align: center;">Controller</td><td style="width: 68.0958%; height: 20px; text-align: center;">Industrial PC + PLC</td></tr><tr style="height: 20px;"><td style="width: 31.7781%; height: 20px; text-align: center;">HMI</td><td style="width: 68.0958%; height: 20px; text-align: center;">15~21 inch Touch Panel</td></tr><tr style="height: 20px;"><td style="width: 31.7781%; height: 20px; text-align: center;">Communication</td><td style="width: 68.0958%; height: 20px; text-align: center;">SECS/GEM, OPC-UA, Ethernet/IP</td></tr><tr style="height: 20px;"><td style="width: 31.7781%; height: 20px; text-align: center;">Data Logging</td><td style="width: 68.0958%; height: 20px; text-align: center;">MES 연동</td></tr><tr style="height: 20px;"><td style="width: 31.7781%; height: 20px; text-align: center;">Recipe Management</td><td style="width: 68.0958%; height: 20px; text-align: center;">Lot별 자동 변경</td></tr></tbody></table></div>5. 공정 성능 지표 (KPI)<div class="table-wrap"><table data-ke-type="table" data-ke-align="alignLeft" style="width: 100%; height: 10px;" border="1"><tbody><tr style="height: 10px;"><td style="width: 31.9042%; height: 10px; text-align: center;">항목</td><td style="width: 67.9697%; height: 10px; text-align: center;">목표</td></tr><tr><td style="width: 31.9042%; text-align: center;">Throughput</td><td style="width: 67.9697%; text-align: center;">≥120 WPH (12")</td></tr><tr><td style="width: 31.9042%; text-align: center;">MTBF</td><td style="width: 67.9697%; text-align: center;">≥ 1000 hr</td></tr><tr><td style="width: 31.9042%; text-align: center;">MTTR</td><td style="width: 67.9697%; text-align: center;">≤ 30 min</td></tr><tr><td style="width: 31.9042%; text-align: center;">OCR Error Rate</td><td style="width: 67.9697%; text-align: center;">≤ 0.02%</td></tr><tr><td style="width: 31.9042%; text-align: center;">Particle Spec</td><td style="width: 67.9697%; text-align: center;">ISO Class 3</td></tr></tbody></table></div>6. 안전 및 규격<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>SEMI S2, S8 준수</li><li>CE 인증 대응</li><li>ESD Safe Design</li><li>Interlock Safety Door</li><li>UV Shield Cover</li></ul>7. 스마트팩토리 대응<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>AI 기반 OCR 학습 기능</li><li>공정 데이터 실시간 분석</li><li>Remote Maintenance</li><li>Predictive Maintenance (Motor/Vacuum Monitoring)</li><li>Big Data Export</li></ul>8. 옵션 사항<ul style="list-style-type: disc;" data-ke-list-type="disc"><li>Auto Tape Splicing</li><li>Dual OCR (Pre/Post Mount)</li><li>UV Irradiation Module</li><li>6inch Conversion Kit</li><li>OHT Full Automation</li></ul>