상품DB/싱가포르 평판 디스플레이 장비 부품 시장동향(2014.11)

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싱가포르 평판 디스플레이 장비 부품 시장동향(2014.11)

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2015-12-11

국가

싱가포르

작성자

오새봄(싱가포르무역관)

품목

그 밖의 기기

품목코드

903180

작성일자: 2014.11.26

작성자: 싱가포르 무역관 Samantha Ho (samantha@kotra.or.kr)

1. Demand Trend

□ Market Size

 ○ The electronics industry is a key contributor of the Singapore economy, accounting for 27% of the total manufacturing output. Between 1993 and 2013, its manufacturing output rose at a compound annual growth rate(CAGR) of 3.3% to S$80 billion, while value added increased at a 4.4% CAGR to S$17.4 billion. With fresh investments, the eco-system has continued to expand. According to the Singapore Economic Development Board, fixed asset investments in electronics totalled S$3.3 billion and S$0.6 billion of total business expenditure in 2013. These projects are expected to contribute S$1.8 billion in value added per annum to Singapore’s Gross Domestic Product. Inference from the import trade statistics for other measuring or checking instruments, appliances or machines provides an indication of the market size of in Singapore. The market value for inspection system and machine imported recorded S$216.7 million in 2013.

Total Imports

HS Code 903180: Other Measuring or Checking Instruments, Appliances and Machines

        (Unit: S$ Thousand)

Rank	Country	2011	2012	2013
1	United States	56,375	77,735	41,034
2	Netherlands	4,217	1,056	32,807
3	Germany	21,543	26,104	26,774
4	Israel	23,612	10,108	15,707
5	Japan	21,667	18,094	15,089
6	Korea	2,261	3,009	11,312
7	China	10,324	9,071	10,698
8	Switzerland	11,028	9,822	10,677
9	United Kingdom	13,788	10,137	10,290
10	Malaysia	12,445	23,863	6,582
Total for the Top 50 countries		210,003	227,862	216,672
Total for other countries		542	455	12
Grand Total		210,545	228,317	216,684

 Source: Statlink, International Enterprise, Singapore

 ○ Supplies from USA, Germany, Israel and Japan accounted for more of the imports, as imports from Korea registered significant growth, amounting to S$11.3 million in 2013.  

□ Market Share

Market Share by Country of Origin

 (Unit: %)

Country	2011	2012	2013
United States	26.8	34.0	18.9
Netherlands	2.0	0.5	15.1
Germany	10.2	11.4	12.4
Israel	11.2	4.4	7.2
Japan	10.3	7.9	7.0
Korea	1.1	1.3	5.2
China	4.9	4.0	4.9
Switzerland	5.2	4.3	4.9
United Kingdom	6.5	4.4	4.7
Malaysia	5.9	10.5	3.0
Others	15.8	17.2	16.5

            Source: Statlink, International Enterprise, Singapore

□ Market Trend

 ○ While Singapore continues to serve as the hub of the microelectronics industry in Southeast Asia, Semiconductor Equipment and Material International(SEMI) recognizes the growth and importance of the industry across the region. According to Gartner, the Southeast Asia microelectronics manufacturing market accounts for more than 27% of the world’s assembly, packaging, and test production and Malaysia alone represents over 10% of the global square footage, followed closely by the Philippines, Thailand and Singapore.  According to the SEMI (www.semi.org) World Fab Forecast, Southeast Asia is among the top four regions in terms of growth rate for capacity. In 2014, approximately $800 million of front end fab spending will occur in Southeast Asia. The key trends and technologies in semiconductor design and manufacturing, place emphasis in serving the needs of expanding applications markets in areas including mobile devices and other connected ‘Internet of Things’(IoT) technologies, many of which require development of specialized materials, packaging, and test technologies, as well as new architectures and processes — technologies addressed by a growing number of companies located across Southeast Asia.  

2. Competition Trend

□ Feedback from trade sources point to vast possibilities to expand the use of automatic vision inspection systems/ machines. The quality of requirements in these applications is becoming higher. Inspection systems which are very competitively marketed in Singapore and these comprise of overseas and local origin products, which include the following:

 ○ KLA-Tencor (USA), through its ICOS division, offers a series of standalone defect inspectors for various applications in the semiconductor packaging field. The Component Inspector(CI) products inspect various semiconductor components that are handled in a tray, such as microprocessors or memory chips. Component defect inspector capability includes: 3D coplanarity inspection; measurement of the evenness of the contacts; and, 2D surface inspection to check the package’s surface aspects, the identification mark and the orientation. The Wafer Inspector (WI) products inspect either undiced wafers, or diced wafers mounted on film frame carriers. This wafer defect inspector inspects surface quality of the wafers, the quality of the wafer cutting, or wafer bumps

  - Component Defect Inspector

   · COS CI-T640 Component Inspector: High production defect inspector with dual taping for low CoO

   · ICOS CI-T120/CI-T130: High-volume defect inspector of Gull Wing, BGA, CSP and QFN devices

  - Wafer Defect Inspector

   · ICOS WI-2xx0: Optical defect inspector and metrology of microelectronic devices on a variety of wafer substrates

   · ICOS WI-22xx Series: Automated optical defect inspector and metrology of microelectronic devices on a variety of wafer substrates, surface inspection, and 2D bump inspection

   · ICOS WI-2280: Next-generation wafer defect inspector capabilities and flexibility for LED applications.

 ○ Optical Gaging Products (USA)

	Optical Gaging Products(OGP) SmartScope Vantage MultiSensor System
	OGP SmartScope ATS MultiSensor System The SmartScope ATS offers high load capacity hydrostatic air bearings riding on precision lapped granite guide members to support heavy.
	OGP SmartScope Apex Micro MultiSensor System SmartScope Apex Micro is a fixed-optics system featuring a digital camera with digital zoom The digital zoom offers multiple magnifications, and a wide range of long working distance fixed optical objectives are available.

 ○ Rudolph Technologies Inc.’s (USA) total Solution package includes one or more Rudolph inspection modules paired with Discover Software? for inline defect analysis and data management and TrueADC Software™ for inline automatic defect classification. Using this approach, wafer fabs and advanced packaging facilities can improve yield by performing high-speed, automated inspection using the Rudolph F30™ or NSX? inspection module for frontside defect detection, and can quickly identify edge and/ or backside defects using the E/B inspection module(s). Rudolph inspection systems can detect defects down to one micron on patterned wafers.

  - F30 Enables resolution-throughput flexibility for multi-process inspection applications

  - NSX 320 Advanced macro defect inspection designed specifically for advanced packaging processes that use TSV.

 ○ Orbotech (Israel) Automated Optical Inspection, AOI

  - Orbotech offers a field-proven automated optical inspection(AOI) solution.

  - Orbotech AOI systems are utilized in production by leading touch screen makers to maximize their final product yield. Featuring cutting-edge capabilities, Orbotech’s AOI systems deliver consistent results that are faster, more accurate and much more cost-effective than visual inspection, bringing a new level of quality to touch screen manufacturing.

 ○ Nikon (Japan)

  - Nikon's most advanced and versatile semiconductor inspection systems, the Optistation 3200 provides three-mode macro inspection capability – front, backside center, and backside perimeter – as well as high performance lighting techniques that allow for detection of a wide variety of process defects and particle/scratch detection.

 ○ Omron (Japan)

  - FlexXpect-PV delivers tailored functionality to align wafers and inspect them for chips and cracks. It features:

   · Easy and intuitive set-up

   · Automatic extraction and teaching of the PV wafer

   · Precise inspections with high resolution cameras

   · Automatic robot calibration

   · Fade-out strings and conveyor belts

  - Supported inspections:

   · Precise wafer and string alignment

   · Accurate chamfer chip inspection

   · Detection of minute edge cracks

   · Bus bar alignment on the wafer

 ○ IN.D Solution (Singapore)

  - Automated Wafer Vision System

   · Developed specially for backend operations to perform simultaneous inspection on both top and bottom side of wafer dedicated to Front Of Line assembly.

 ○ Generic Power (Singapore)

 

  - Applications:

   · Mark and OCR Inspection

   · Package Visual Inspection

   · Alignment & Gauging

   · Measurement (2D & 3D)

   · Parts Recognition

 ○ PS Technologies (Singapore)

  - The wafer inspection machine developed allows the switching of inspections for different product types automatically. Furthermore, the inspection sampling scheme is user-configurable.

   · Use of high resolution, auto-zoom optics to achieve sub-micron accuracy in the measurement of die misalignment and surface defects.

   · Incorporation of various customized image processing techniques to enable the machine to detect glue smears, contaminants, scratches, dents and missing features

   · Ability to measure dimple depths with a resolution of 2nm

   · Ability to tap wafer contour with a resolution of 0.1 micron

   · Application of high precision linear motor stages that enables the machine to achieve high-speed positioning

 ○ Vitronic (Germany)

  - The VINSPEC Solar is an inspection machine for photovoltaic wafers. The machine is capable of carrying out microrack inspections, contour, and surface examinations. This apparatus can also perform inspections for the front and rear print in the production cycle for wafers and solar cells.

  - Inspection values are transmitted to manufacturing execution system(MES) systems in databases. The system is also helpful when it comes to enhancing processes.