Wafer Mounter System

[Coreonix]

엠티에스코리아

james9790@daum.net

031 499 9790

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📄 Wafer Mounter System

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1. EQUIPMENT OVERVIEW

본 장비는 반도체 후공정에서 Si Wafer를 Ring Frame에 UV Tape를 이용하여 자동 부착(Mounting)하는 전자동 시스템이다.

공정 구조는 다음과 같다:

Wafer 선 로딩 → Frame 후 로딩 → UV Tape Bonding → Unloading

본 시스템은 Wafer와 Ring Frame을 각각 독립 Flipper로 제어하여
정밀 위치 정합 및 안정적 본딩 품질을 확보한다.

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2. PROCESS FLOW (Actual Mechanical Sequence)

STEP 1 – Wafer Supply

1. SI Wafer Cassette Elevator
2. Dual Arm Robot Pick
3. Wafer Aligner (Notch/Flat 정렬)

STEP 2 – Wafer Loading to Bonding Table

1. 180° Flipper (Wafer 전용)
2. Wafer → Bonding Table 안착
3. Flipper 원위치 복귀 

STEP 3 – Ring Frame Loading

1. Ring Frame Slide Stage 이동
2. 180° Flipper (Frame 전용)
3. Ring Frame → Bonding Table 정위치 안착
4. Flipper 복귀 대기

STEP 4 – UV Tape Bonding

1. UV Tape Feeding
2. Tape Lay Down
3. Z-Axis Press Head 압착
4. Tape Cutting

STEP 5 – Unloading

1. Frame Pusher 배출
2. Output Cassette Elevator 적재

3. SYSTEM CAPABILITY

Item	Specification
Applicable Wafer Size	6", 8" (Option: 12")
Wafer Thickness	100 ~ 775 μm
Frame Size	6"/8" Standard
Throughput	100 ~ 150 WPH
Yield	≥ 99.5%
MTBF	≥ 1,000 hrs
OEE Target	≥ 85%

4. MAIN MODULE SPECIFICATION

4.1 Cassette Elevator (Input / Output)

Item	Spec
Cassette Type	Open / SMIF Option
Slot Capacity	25 Slots
Drive System	AC Servo
Position Accuracy	±0.1 mm
Sensor	Slot Detection

4.2 Dual Arm Robot

Item	Spec
Arm Type	Dual Vacuum Arm
Repeatability	±0.05 mm
Drive	Servo Motor
Vacuum Monitoring	Pressure Sensor
Cycle Time	≤ 4 sec

4.3 Wafer Aligner

Item	Spec
Alignment Accuracy	±0.05°
Centering Accuracy	±0.03 mm
Vision System	CCD 5MP 이상
Rotation Speed	Max 300 rpm

4.4 180° Flipper (Wafer 전용)

Item	Spec
Rotation Angle	180°
Repeatability	±0.05 mm
Holding Type	Vacuum Chuck
Cycle Time	≤ 3 sec
Interlock	Vacuum OK 시 동작

4.5 180° Flipper (Frame 전용)

Item	Spec
Rotation Angle	180°
Clamp Type	Mechanical Edge Clamp
Repeatability	±0.05 mm
Cycle Time	≤ 3 sec

4.6 Bonding Table (Core Module)

구조

Granite Base Structure

Vacuum Chuck (Wafer 기준)

Frame Guide Pin 정렬 구조

Z-axis Press Head

사양
Item	Spec
Table Flatness	≤ 10 μm
Wafer Vacuum	≥ -80 kPa
Press Force	50 ~ 300 N Adjustable
Press Uniformity	±5%
Temperature	RT ~ 70℃ (Option)

4.7 UV Tape Feeding & Cutting Module

Item	Spec
Tape Width	Max 300 mm
Tension Control	Closed Loop Servo
Tension Accuracy	±5%
Cutter Type	Motorized Blade
Edge Accuracy	±0.3 mm

4.8 Ring Frame Slide Stage

Item	Spec
Drive	Ball Screw + Servo
Stroke	400 mm
Position Accuracy	±0.02 mm

5. CONTROL SYSTEM

Item	Specification
PLC	Mitsubishi / Siemens
HMI	15" Touch Panel
Communication	SECS/GEM Option
Data Logging	Bonding Pressure / Tension Monitoring
Interlock Logic	Wafer Load Confirm‎ → Frame Load Enable

6. SAFETY SYSTEM

Emergency Stop (2 Point)

Door Interlock

Overtravel Sensor

Vacuum Loss Alarm

CE 대응 가능

7. UTILITIES

Item	Specification
Power	AC 220V / 380V 3P
Air	5~6 kgf/cm²
Vacuum	-80 kPa
Power Consumption	5~8 kW

8. MACHINE SIZE

Item	Specification
Footprint	1900(W) × 1130(D) × 1620(H) mm
Weight	Approx. 1.5 ~ 2 Ton

9. KEY DESIGN ADVANTAGE

✔ Wafer 선로딩 구조로 정밀 기준면 확보
✔ Wafer/Frame Flipper 독립 구조로 충돌 리스크 최소화
✔ Closed Loop Tension Control 적용
✔ 압력 균일도 ±5% 확보
✔ 향후 12" 확장 가능 구조