Re:Re:Re:메일 을 가르쳐 주세요..첨부가 안되서..

님의 메일을 적어 주시기 바랍니다. 첨부가 안되어서요. 나스트란 자료는 PDF약 10MB입니다. 근데 이것은 누가 해 놓은 해석이지요? /prep7 antype,static ! analysis type : steady state heat transfer analysis ! Metric (meter, N, kg, sec) /units,SI ! define element type et,1,plane55 ! thermal 2D element !*****************************************! ! define material properties ! thermal conductivites W/mm C mp,kxx,1,172e-3 ! lead : 172e-3 mp,kxx,2,140e-3 ! silicon : 140e-3 mp,kxx,3,0.88e-3 ! molding compound : 0.88e-3 mp,kxx,4,3.7e-3 ! epoxy : 3.7e-3 mp,kxx,5,172e-3 ! lead frame : 172e-3 mp,kxx,6,52.9e-3 ! solder(96.5Sn/3.5Ag solder) : 13e-3 mp,kxx,7,172e-3 ! PCB(copper) : 172e-3 mp,kxx,8,13e-3 ! PCB(fr-4) : 13e-3 !*****************************************! ! define parameters of the package size ! Package size : 5 by 5 mm pkg_wi=5.0 ! package wideness pkg_le=5.0 ! package length pkg_th=0.9 ! package thickness lead_le=0.53 ! lead length lead_wi=0.35 ! lead wideness lead_pitch=0.50 ! lead paitch et_wi=0.05 ! etch widness et_de=0.1 ! etch depth ! Pad size : 3 by 3 mm pad_wi=3.0 ! die pad wideness pad_le=3.0 ! die pad length pad_th=0.2 ! die pad thickness ! Die size : 2.65 by 2.65 mm di_wi=2.65 ! die wideness di_le=2.65 ! die length di_th=0.02540*8 ! die thickness pcb_wi=20.0 ! PCB wideness pcb_th=1.60 ! PCB total thickness ep_th=0.05 ! epoxy thickness so_th=0.02540*2.3 ! solder thickness : 1 mil -> 0.02540 mm ounce=0.035 ! 1 ounce/ft^2 = 0.035 mm co_tr=2*(ounce) pl_1=1*(ounce) pl_2=1*(ounce) ba_tr=2*(ounce) diel_th=0.4633 !********************************************************** ! simulations conditions : heat generation & convection ! !********************************************************** ! heat generation of die po_di=2 ! power dissipation : 2 Watt di_vo=(di_wi*di_le*di_th) ! die volume he_ge=po_di/di_vo ! heat generation=power dissipation/die volume ! ! convection conditions : natural convection ! vertical plate f_1=1.22 n_1=0.35 ! horizontal plate f_2=1.00 n_2=0.33 ! temperature difference : 4.677 tempd=4.677 lch_1=pkg_th ! vertical plate lch_2=(pkg_wi*pkg_le)/(2*(pkg_wi+pkg_le)) ! horizontal plate ! film coefficients of the vertical plate hc_1=0.83*f_1*((tempd/lch_1)**n_1) ! film coefficients of the horizontal plate hc_2=0.83*f_2*((tempd/lch_2)**n_2) !*****************************************! ! solid modeling rect,,pkg_wi/2,,pkg_th rect,,pad_wi/2,,pad_th rect,,di_wi/2,,(pad_th+ep_th) rect,,di_wi/2,,(pad_th+ep_th+di_th) rect,(pkg_wi/2-lead_le),(pkg_wi/2-et_wi),,pad_th rect,,pad_wi/2,,-so_th rect,(pkg_wi/2-lead_le),(pkg_wi/2-et_wi),,-so_th rect,,pad_wi/2,,pkg_th rect,,di_wi/2,,pkg_th rect,(pkg_wi/2-lead_le),(pkg_wi/2-et_wi),,pkg_th rect,,pkg_wi/2,,pad_th rect,,pkg_wi/2,,(pad_th+ep_th) rect,,pkg_wi/2,,(pad_th+ep_th+di_th) rect,,di_wi/2,,-so_th ! PCB modeling rect,,pcb_wi/2,-so_th,-pcb_th-so_th rect,,di_wi/2,-so_th,-pcb_th-so_th rect,,pad_wi/2,-so_th,-pcb_th-so_th rect,,(pkg_wi/2-lead_le),-so_th,-pcb_th-so_th rect,(pkg_wi/2-lead_le),(pkg_wi/2-et_wi),-so_th,-pcb_th-so_th rect,,pcb_wi/2,-so_th,-(so_th+co_tr) rect,,pcb_wi/2,-so_th,-(so_th+co_tr+diel_th) rect,,pcb_wi/2,-so_th,-(so_th+co_tr+diel_th+pl_1) rect,,pcb_wi/2,-so_th,-(so_th+co_tr+diel_th+pl_1+diel_th) rect,,pcb_wi/2,-so_th,-(so_th+co_tr+diel_th+pl_1+diel_th+pl_2) rect,,pcb_wi/2,-so_th,-(so_th+co_tr+diel_th+pl_1+diel_th+pl_2+diel_th) aovlap,all numcmp,all !*****************************************! ! mesh generation esize,0.10 ! element size : 0.05 mm ! die pad mat,1 asel,s,,,3 asel,a,,,12 amesh,all allsel ! silicon mat,2 asel,s,,,4 amesh,all allsel ! molding compound mat,3 asel,s,,,2 asel,a,,,6 asel,a,,,8 asel,a,,,9 asel,a,,,11 asel,a,,,14 asel,a,,,16 asel,a,,,17 asel,a,,,18 asel,a,,,19 asel,a,,,20 asel,a,,,25 asel,a,,,26 asel,a,,,42 asel,a,,,43 amesh,all allsel !epoxy mat,4 asel,s,,,5 amesh,all allsel mat,5 ! lead asel,s,,,1 amesh,all allsel ! solder mat,6 asel,s,,,7 asel,a,,,13 asel,a,,,15 amesh,all allsel ! PCB(copper) mat,7 asel,s,,,10 asel,a,,,21 asel,a,,,22 asel,a,,,23 asel,a,,,24 asel,a,,,27 asel,a,,,28 asel,a,,,29 asel,a,,,30 asel,a,,,31 asel,a,,,34 asel,a,,,35 asel,a,,,38 asel,a,,,39 asel,a,,,45 asel,a,,,47 asel,a,,,50 asel,a,,,52 asel,a,,,55 asel,a,,,57 amesh,all !PCB(FR-4) mat,8 asel,s,,,32 asel,a,,,33 asel,a,,,36 asel,a,,,37 asel,a,,,40 asel,a,,,41 asel,a,,,44 asel,a,,,46 asel,a,,,48 asel,a,,,49 asel,a,,,51 asel,a,,,53 asel,a,,,54 asel,a,,,56 asel,a,,,58 amesh,all allsel nummrg,node nummrg,elem nummrg,kp numcmp,all /pnum,mat,1 /num,1 fini /solu !!******************************************** !! define ambient temperature ! define heat generation at die asel,s,,,4 esla bfe,all,hgen,,he_ge allsel ! define convection ! vertical plate of the package lsel,s,,,26 lsel,a,,,43 lsel,a,,,54 lsel,a,,,68 sfl,all,conv,hc_1,,55 allsel ! horizontal plate of the package lsel,s,,,9 lsel,a,,,21 lsel,a,,,42 lsel,a,,,52 lsel,a,,,66 sfl,all,conv,hc_2,,55 allsel solve fini !*****************************************! /post1 /udoc,1,cntr,right plnsol,temp prrsol,heat save,qfn_section.db --------------------- [원본 메세지] --------------------- 빙구님~~ 그람 그 내용들이 어떤거며, 좀더 자세한 내용좀 알려주심 알될까요?? 어디에서 보셨다던지 하는거요... 부탁드립니다... --------------------- [원본 메세지] --------------------- ANSYS말고 NASTRAN에 이런것 해석 해놓은것을 봤는데.. --------------------- [원본 메세지] --------------------- BCA chip이나 Ceramic chip에 대해 해석해본신분 계세요.. 해보셨으면, 도움될만한 자료나 tip있으시면,, 연락좀 주세여.. 부탁임다.. 꼭좀 확인하시구.. 답좀주세요~~