Tech Daily (Apr 13 2026)

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[한투증권 채민숙/김연준] Tech Daily (Apr 13 2026)

● Daily News Clipping

▶️ 삼성전자, 베트남 북부에 약 40억 달러 규모의 반도체 패키징 시설 건설 계획 (Trendforce) < https://vo.la/sWKlZun >

▶️ SK하이닉스, 이달부터 M15X에서 HBM4 및 서버용 DRAM 생산 본격화 (Digitimes) < https://vo.la/bHy1ztR >

▶️ TSMC, 1분기 최대 실적 경신…AI칩 호황 증명 (Zdnet) < https://vo.la/bdN9TNS >

▶️ TSMC의 CoWoS 패키징에 대한 수요가 CAGR 80%로 성장함에 따라 심각한 공급부족이 발생하고 있음 (Digitimes) <https://vo.la/kmeV6SA >

▶️ 아마존이 자체 칩을 외부 고객에게 판매하는 방안을 검토 중이며, 앤트로픽 역시 자체 칩 개발을 계획 중 (Trendforce) < https://vo.la/Vaebahr >

▶️ OpenAI의 스타게이트 UK 프로젝트가 에너지 비용 및 규제 문제 등으로 인해 잠정 중단 (Digitimes) < https://vo.la/ZDijS3k >

▶️ "D램 가격 상승률, 1분기 70%→2분기 30~50%로 둔화 전망" (Zdnet) < https://vo.la/zcsQDBI >

▶️ 일본 정부가 라피더스에 6,315억엔의 연구 개발 보조금을 지급 (Reuters) < https://vo.la/TCKMHTE >