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<p>애플 미국 투자 요약  <br>[대신증권 반도체/류형근] <br><br>■ 총 투자규모 상향 <br><br>- 금일 미국에 대한 1,000억 달러의 신규 투자를 발표 <br><br>- 향후 4년간 미국 내 총 투자액을 6,000억 달러로 대폭 확대할 것 <br><br>■ Apple American Manufacturing Program (AMP) <br><br>- Corning, Coherent, GlobalWafers America (GWA), Applied Materials, Texas Instruments (TI), Samsung, GlobalFoundries, Amkor, Broadcom 등이 포함 <br><br>- Corning: 켄터키주에 세계 최대 스마트폰용 유리 생산라인 신설 예정. 향후 모든 iPhone 및 Apple Watch의 유리는 이곳에서 생산.  <br><br>- Coherent: iPhone과 iPad의 Face ID 등 기능을 위한 VCSEL 레이저를 생산하는 텍사스 셔먼 시설과의 다년 계약 체결. <br><br>- MP Materials: 포트워스 인디펜던스 시설 확장 및 캘리포니아 마운틴패스에 희토류 재활용 라인 구축 예정. <br><br>■ 미국 내 실리콘 공급망 구축 확대 <br><br>- 웨이퍼 생산: GlobalWafers America (텍사스 셔먼)와 협력하여 미국 내 최초로 300mm 웨이퍼를 생산. 이 웨이퍼는 TSMC(애리조나) 및 TI(셔먼) 등에서 칩으로 가공. 웨이퍼에 사용되는 실리콘은 Corning의 Hemlock Semiconductor 등 미국 공급처에서 조달. <br><br>- 장비 생산: Applied Materials (텍사스 오스틴)와 협력하여 첨단 반도체 제조 장비 생산 확대. <br><br>- 반도체 제조: TI의 유타 리하이 및 셔먼 신공장에 장비 추가 및 확장 투자. Apple 제품에 사용되는 주요 기초 반도체 생산. <br><br>- 신기술 도입: Samsung (오스틴)과 협력하여 전 세계 최초로 새로운 칩 제조 기술 상용화. iPhone에 적용될 성능 최적화 칩 생산 예정. <br><br>- 무선/전력 칩: GlobalFoundries와 협력하여 무선통신 및 전력관리 반도체 생산 확대. <br><br>- 패키징: Amkor의 애리조나 첨단 패키징 및 테스트 공장에 투자. Apple은 이 공장의 첫 번째 및 최대 고객. 인근 TSMC 공장에서 제조된 Apple 실리콘 칩의 패키징 담당. <br><br>- Broadcom 및 GlobalFoundries와 협력하여 5G 통신에 필요한 셀룰러 반도체 부품을 미국에서 개발 및 제조 <br><br>기사 링크: <a href="https://www.apple.com/newsroom/2025/08/apple-increases-us-commitment-to-600-billion-usd-announces-ambitious-program/" target="_blank" class="ke-link">https://www.apple.com/newsroom/2025/08/apple-increases-us-commitment-to-600-billion-usd-announces-ambitious-program/</a></p>
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