<h3>외국계R&D DSP Team Manager</h3><h4 class="gray"><a href="https://www.peoplenjob.com/jobs?user_id=331164"><u><font color="#0066cc">HRMENTO</font></u></a></h4><dl class="list-detail"><dt>근무지역 :</dt><dd><a href="https://www.peoplenjob.com/headhunting/jobs?field=scope.workLocationTag&q=%EC%84%9C%EC%9A%B8%20%EA%B5%AC%EB%A1%9C%EA%B5%AC"><u><font color="#0066cc">서울 구로구</font></u></a> </dd><dt>등록일 :</dt><dd>2019.11.22</dd><dt>직종 :</dt><dd><a href="https://www.peoplenjob.com/jobs?type=work&work_code_id=80"><u><font color="#0066cc">전자,반도체</font></u></a> / <a href="https://www.peoplenjob.com/jobs?type=work&work_code_id=88"><u><font color="#0066cc">기타</font></u></a> </dd></dl><div class="job-detail row"><h4>Job Description</h4><div class="divDetailWrap"><div>– 한국 R&D연구소장에 reporting (; DSP 팀장)<br><br>DUTIES & RESPONSIBILITIES:<br><br> - Design, develop, test and optimize real-time DSP algorithms in HDL, C/C++<br> - Modeling and simulation using Matlab or C to analyze system performance and design<br> - Design on FPGA using HDL(VHDL and Verilog )<br> - Implementation of embedded software functions in C/C+<br> - Manage the engineering development and program execution of DSP/FPGA related design<br><br> - Engineering management and engaged involvement in all aspects of DSP/FPGA <br> development and integration efforts as well as project management skills<br><br> #채용사소개<br><br>​1989년에 설립된 회사로 매출액 162억 사원수 80명 규모의 외국 법인기업입니다.<br>무선통신 신기술 및 신장비/통신계측기/소프트웨어개발사업을 하고 있습니다<br>- 사업장 위치 : 서울 금천구 가산디지털단지<br> 세계적인 유무선 측정 솔루션 및 광 통신, 광학기술에 관한 선두주자로<br> 전세계 주요 케이블 및 통신 사업자, 네트워크 장비 제조사에게 광대역 테스트 및 측정 솔루션을 공급하고,<br>통신 및 상업, 소비재 시장에 광 제품을 공급하는 나스닥 상장기업입니다. 미국 캘리포니아 지역에 본사를 두고, 전 세계 약 85개국에 세일즈 오피스 및 R&D 센터를 보유하고 있으며, 아시아, 태평양 지역의 한국지사입니다.<br><br><br></div></div><h4>Job Requirements</h4><div class="divDetailWrap"><div> Technical QUALIFICATIONS:<br><br> - Must have a BS degree in Electronics or Telecommunication engineering (or similar);<br> MS degree is preferred.<br><br> - In-depth knowledge in FPGA and Digital Hardware<br> - In-depth knowledge in Wireless technologies e.g. 5G, LTE, UMTS, GSM, CDMA, etc<br> - In-depth knowledge in digital communications and MODEM technologies<br><br> - Preferred technical background in circuit design and implementation, including programming <br> and component interfaces<br> - Preferred experience of layout design of FPGA-based board-level components<br> - Understanding and preferred experienced in CPRI/eCPRI standards areas design and <br> implementation<br><br><br> Personal QUALIFICATIONS:<br><br> - Good ability to communicate in English (reading, writing and presentation)<br> - Good ability to transfer and provide knowledge to others<br> - Good ability to listen to, and understand, the opinions of others while holding strong personal views<br> - Good ability to build effective, healthy relationships with engineers, peers, supervisors, and customers<br> - Good ability to function as a valued member of a team and inspire teamwork around them<br> - Good ability to follow through tasks in a consistent way<br> - Very good ability to understand real needs and future wireless market trends<br></div></div><h4>Additional Information</h4><div class="divDetailWrap"><dl class="list-detail"><dt>커리어수준 :</dt><dd>관리자</dd></dl><dl class="list-detail"><dt>급여사항 :</dt><dd>면접 후 협의 (8천만~1억_기본연봉)</dd></dl><dl class="list-detail"><dt>고용형태 :</dt><dd>정규직</dd></dl><dl class="list-detail"><dt>경력여부 :</dt><dd>경력15년이상, 50대초반까지</dd></dl></div><h4>Guidelines for Applicants</h4><div class="divDetailWrap"><dl><dt>전형방법 :</dt><dd>1차 서류전형<br>2차 면접전형 </dd></dl><dl><dt>제출서류 :</dt><dd>한글이력서, 영문이력서, 한글자기소개서 (각종 증빙서류는 서류전형합격자에 한해 추후제출) </dd></dl><dl><dt>접수방법 :<br></dt></dl></div></div><p><br></p>
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