SK하이닉스, 차세대 냉각 신기술 ‘iHBM’ 공개…AI 시스템 효율 높인다

<p style="text-align: left;"><a href="https://www.aipostkorea.com/news/articleView.html?idxno=11571&fbclid=IwdGRleASDgWZleHRuA2FlbQIxMQBzcnRjBmFwcF9pZAo2NjI4NTY4Mzc5AAEeYR6CZc7BaHyAmH1zDvv3szk8nV-u9GaPBNkmJrQ223OPe_fTICKjmuzQaRQ_aem_4dcTl5rHY02BEuvL7HcslA" target="_blank" class="ke-link">https://www.aipostkorea.com/news/articleView.html?idxno=11571&fbclid=IwdGRleASDgWZleHRuA2FlbQIxMQBzcnRjBmFwcF9pZAo2NjI4NTY4Mzc5AAEeYR6CZc7BaHyAmH1zDvv3szk8nV-u9GaPBNkmJrQ223OPe_fTICKjmuzQaRQ_aem_4dcTl5rHY02BEuvL7HcslA</a></p><div class="figure-open" contenteditable="false" data-ke-type="opengraph" data-ke-align="alignCenter" data-og-type="website" data-og-title="SK하이닉스, 차세대 냉각 신기술 ‘iHBM’ 공개…AI 시스템 효율 높인다" data-og-description="SK하이닉스가 HBM 패키지에 일체형 냉각 요소 ‘ICE’를 내재해 발열을 획기적으로 낮춘 ‘iHBM’ 기술을 26일 공개했다.폭증하는 AI 연산 수요 대응을 위해 HBM은 적층 단수 확대와 고속화를 거듭하" data-og-host="www.aipostkorea.com" data-og-source-url="https://www.aipostkorea.com/news/articleView.html?idxno=11571&fbclid=IwdGRleASDgWZleHRuA2FlbQIxMQBzcnRjBmFwcF9pZAo2NjI4NTY4Mzc5AAEeYR6CZc7BaHyAmH1zDvv3szk8nV-u9GaPBNkmJrQ223OPe_fTICKjmuzQaRQ_aem_4dcTl5rHY02BEuvL7HcslA" data-og-url="https://www.aipostkorea.com/news/articleView.html?idxno=11571" data-og-image="http://scrap.kakaocdn.net/dn/imoiB/dJMb8Yp1Vw7/B5VjNKNP1hyiZqeFbZMlQ0/kakaolink40_original.png?width=960&height=640"><a href="https://www.aipostkorea.com/news/articleView.html?idxno=11571&fbclid=IwdGRleASDgWZleHRuA2FlbQIxMQBzcnRjBmFwcF9pZAo2NjI4NTY4Mzc5AAEeYR6CZc7BaHyAmH1zDvv3szk8nV-u9GaPBNkmJrQ223OPe_fTICKjmuzQaRQ_aem_4dcTl5rHY02BEuvL7HcslA" target="_blank" data-source-url="https://www.aipostkorea.com/news/articleView.html?idxno=11571&fbclid=IwdGRleASDgWZleHRuA2FlbQIxMQBzcnRjBmFwcF9pZAo2NjI4NTY4Mzc5AAEeYR6CZc7BaHyAmH1zDvv3szk8nV-u9GaPBNkmJrQ223OPe_fTICKjmuzQaRQ_aem_4dcTl5rHY02BEuvL7HcslA"><div class="og-image"><img class="thumb_img" src="http://scrap.kakaocdn.net/dn/imoiB/dJMb8Yp1Vw7/B5VjNKNP1hyiZqeFbZMlQ0/kakaolink40_original.png?width=960&height=640" alt="" xxonerror="this.src="//img1.kakaocdn.net/thumb/C200x200/?fname=https%3A%2F%2Ft1.daumcdn.net%2Fcafe_image%2Fcafe_meta_image_190529.png""></div><div class="og-text"><p class="og-title">SK하이닉스, 차세대 냉각 신기술 ‘iHBM’ 공개…AI 시스템 효율 높인다</p><p class="og-desc">SK하이닉스가 HBM 패키지에 일체형 냉각 요소 ‘ICE’를 내재해 발열을 획기적으로 낮춘 ‘iHBM’ 기술을 26일 공개했다.폭증하는 AI 연산 수요 대응을 위해 HBM은 적층 단수 확대와 고속화를 거듭하</p><p class="og-host">www.aipostkorea.com</p></div></a></div><p style="text-align: left;"><span></span></p>