Die Attach(Solder and Epoxy), Inductive
soldring, PCB cleaning
- Process Standardirzation
Process Capability Assessment : Analyze and
manage CPK of production equipment
Documentation for new or improved
manufacturing process.
- Production yield
Data collection for production yield :
Delinquency Data Collection
Activities for improvement : Analyze the LSPS’
production yield trend.
- Cost reduction - Co-work with SCM
- Failure Analysis - Co-work with Quality
Perform analysis of root cause of failure of
manufacturing process and recommend
changes in manufacturing process.
Determine root causes of failures of product
receiving form customers
using destructive inspection.
- Process Development - Co-work with R&D
Perform feasibility test for new process for
existing or new products.
- Process Qualification
Feasibility test for mass production.
Evaluate mass production feasibility using
4M(Man, Machine, Material, Method)
Build sample process, request QM Div.
for reliability test. |
- More than 3 years of work
experience in semiconductor
process engineering.
- Major: Bachelor’s degree
electricity and electric
engineering,
Semiconductor engineering,
material engineering etc.
- English : Intermediate level. |