>>>> 임의로 디자인 할 수 있습니다.
먼저 커브로 런너를 모델링합니다.(POINT로 거리를 지정해서 모델링해도 됩니다.)
커브는 크게 게이트부, 런너부, 스푸루 부가 있을것입니다.
게이트부를 모델링할 경우 게이트부를 클릭하면 커브의 색이 변합니다.
그리고 커서를 커브에 마우스 왼쪽 버튼 클릭하면 커브 색깔이 변합니다.
마우스 오른쪽을 클릭하면 팝업창이 나타납니다. properties를 선택합니다.
새로운 팝업창이 나타나게 되고 팝업창에서 select를 선택합니다.
그러면 런너시스템에 관련된 명령어가 나타납니다.
그 다음은 설명않해도 아실거구요....
설정이 끝나면 메쉬 생성 아이콘을 다시 수행하시면 됩니다.
그리고
잔류응력에 대한 해석은 가능한지 궁금합니다.
pressure를 보고 파단해야 하는것인지......
>>>> 따로 잔류응력을 계산하는 해석은 없습니다.
잔류응력결과를 보시려면 Pressure결과를 시간대 별로 보시면서 판단하는 방법과
( 과도한 압력이나 적절하지 못한 런너시스템의 지름이면 보압후에도 압력이 많이
남아있는것을 볼 수있고 제품 두께가 얇아도 압력이 남아잇는것을 볼수 있습니다.)
Shear stress at wall의 결과를 보고 판단할수 있습니다. 수지 데이타를 확인하시면
Maximum Shear stress를 볼 수 있는데 수지데이타의 이값보다 결과 값이 크게
나타나면 사출후 스트레스가 보이기도 하고 충격테스트시 판손을 우려 할 수 있습니다.
방법은 않생기게 하면 되겠죠.......ㅋㅋㅋ
그밖에 (자세한 설명을 위해 원문을 올립니다.)
thermoplastic overmolding (두개의 다른 재료를 이용한 사출)
:MPI/Co-Injection 모듈
>>>> Evaluate the flow front pattern of two co-injected materials to aid in part design and gate placement
Predict the extent of penetration of the core material and whether it will break through the skin material
Determine injection pressure and clamp force requirements for proper molding machine selection
Balance and minimize runner systems to achieve uniform cavity filling with reduced scrap or regrind material
Determine the best transition point for switching from skin-material injection to core-material injection
Place gate locations to minimize injection pressure and clamp force
Simulate different inlet melt temperatures for skin and core materials
Automatically incorporate the recommended ram-speed profile from MPI/Flow to reduce overshearing of the plastic during filling
Accurately identify weld and meld lines based on part design and gate placement
Simulate independent flow paths of the two materials in the feed system
reactive molding (반응사출인가요?)
MPI/Reactive Molding allows you to predict how the mold will fill, with or without the presence of fiber reinforced pre-forms, to avoid short shots due to pre-gelation of the resin, highlight potential air traps and identify problem weld lines, balance runner systems, select the proper molding machine size, and evaluate different thermoset materials for various applications.
Predict the flow front pattern to aid in part design and gate placement to optimize cavity filling
Calculate the conversion (extent of cure) versus time at any location within the mold
Determine injection pressure and clamp force requirements for proper molding machine selection
Display injection pressure at any point within the cavity at any time during filling
Graphically display the temperature change as a result of the reaction kinetics inside the mold at any time
Detect short shots due to pre-gelation conditions
Accurately identify weld lines based on part design and gate placement
Accurately identify air traps for proper mold venting
Define multiple anisotropic fiber mats with different orientations in the cavity for RTM and SRIM process simulations
Simulate the packing phase to estimate part shrinkage and gate freeze-off time (3D models only)
Evaluate the final part shape and deformation (3D models only)
microchip encapsulation
>>>>>Calculate the temperature and degree of cure of the preform material in the pot prior to transfer to the mold cavities
Balance the runner system for multi-cavity systems
Calculate global flow field values for velocity, temperature, and degree of cure at each time step
Determine the local flow field around each microchip wire in order to calculate drag force along each wire
Calculate drag force at different temperatures and velocities
Interface with MPI/Stress to perform graphic wire-sweep calculation to determine actual wire shape
Interface with MPI/Stress to predict paddle shift
Interface to ABAQUS to facilitate additional considerations for wire sweep and paddle shift
Simulate the continuous deflection of paddle and lead frame (3D models only)
underfill encapsulation
MPI/Underfill Encapsulation is an optional add-on module that extends the capabilities of MPI/Reactive Molding to simulate the pressurized underfill encapsulation process
Predict the flow of the encapsulant material in the cavity, between the chip and the substrate during the underfill encapsulation process.
Evaluate the standard results from MPI/Reactive Molding, including pressures, temperatures, and conversion (degree of cure).
Underfill encapsulant material properties are the same as those of encapsulation molding compounds used for standard microchip encapsulation, with these two differences:
For underfill encapsulant rheological data, the Herschel -Bulkley-WLF model includes one additional term to describe thickness.
Underfill encapsulants include an additional data category, surface tension. In the underfill encapsulation process, when the encapsulant is dispensed, the driving force is the capillary force at the flow front. To analyze this dispensing process, surface tension data is required. The dynamic temperature-dependent surface tension model by Han is used.